Dicing / Scribing
Introduction
Separation of individual device dies following wafer scale lithography is accomplished using either a wet or dry dicing process. In a wet dicing operation, a precision high-speed diamond impregnated blade is used to mill narrow grooves between adjacent dies either partially or completely through a wafer(s). During this process, water is circulated over the cutting surface to cool the blade and prevent the liberation of dangerous particulates. In a dry process, a diamond tipped stylus is drawn across the wafer surface creating lines of high-stress which are later broken over precision fulcrum. Done properly, this processing technique is debris free. Choice of the appropriate process will be apparent from the target application and materials.
Applications
Wafer separation is a staple process in micro and nanofabrication.
Equipment
The MCN houses two computerized wafer dicing instruments. The Disco DAD321 automated dicing saw, for wet dicing processes, and the Dynatex DTX - Scriber/Breaker for dry processing.
Documentation
For more information on the capabilities of these instruments, please refer to the
information below.
DISCO-DAD321: http://www.mems-exchange.org/equipment/E1189/
Dynatex DTX: http://www.dynatex.com/images/DTX-200-ADB_Tech_Data_Sheet.pdf
Contacts
For information and training on these tools and related processes, please contact:
Dr. Sean Langelier - sean.langelier@monash.edu
