EVG Mask Aligner + NIL Installed

MCN is excited to announce that a critical component of for next generation lithography, the EVG620 Mask Aligner with Nano-Imprint Lithography and the EVG 520 Substrate Bonder, has been installed and commissioned.

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The EVG620 allows for UV-NIL with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter, capable of achieving resolution in the nm range. The semi-automated EVG520 system is designed for embossing and thermal nanoimprinting applications. The hot embossing system is configured with a universal embossing chamber, high vacuum (1E-6 Torr), high temperature (up to 650°C) and high-contact force (up to 40kN) capabilities and manages the whole range of polymers suitable for hot embossing. Together with precision alignment and high-aspect ratio embossing many processes for high quality pattern transfer and nm resolution are offered.

These production-proven systems from EVG accept substrates up to 150 mm and are compatible with standard semiconductor manufacturing technologies. These tools are capable of handling up to 6” wafers and are available for use now.

Please contact Sasi Kandasamy or Lim Sim for further details.

 

10th August 2010