Plasmalab 100 ICP380
The two Plasmalab 100 ICP380 deep reactive ion etchers allow selective processing of materials that have been pre-patterned and masked using other tools in the facility.
Thes
e plasma tools were chosen for the flexibility they offer and their advanced technical fit out offered by the supplier. The first ICP380 is devoted to deep silicon etching, using both the Bosch process and cryo-etching process. The other ICP380 system is for general deep etching and RIE of a wide range of materials. Both these tools constitute a unique pair of its kind in Australia, and allow researchers to fabricate novel microsystems.
This equipment can be booked through ACLS after receiving the appropriate inductions.
