Publications Your Results UV Epoxy bonding for enhanced SAW transmission and microscale acoustafluidic integration Journal: Lab on a chip, RSC Authors: S.Langelier, L.Yeo, J.Friend Publication Library Refine by: Date This Month This Year Newest to Oldest Oldest to Newest Field of study 2D Materials 3D Printing Additive manufacturing Adhesion ANFF-VIC Antibiotics Atomic Force Microscopy Atomic layer deposition Automization Biochemistry Biomedical Biomolecule Biosensing Biosensors Cell Culture Cells Characterisation CMSS Coatings Colloid and Surfaces Design house Diamond Diamonds Diffractive imaging Drug delivery Electrical properties Electrochemical Electrochemical properties Electrochemical Sensing Electrochemistry Electronics Energy Environment Environmental Etching Fibers Filtration Flexible electronics Graphene Hydrogels IFM lab-on-a-chip Liquid Crystals MCFP MCN Medical Bionics Membrane membranes MEMS Metasurface Metasurfaces Microanalysis Microfluidic Microfluidics MNRF Nanofabrication nanofluidics Nanolithography Nanoparticles Nanowire Nanowires Novel materials Optical Properties Optics Photonics Photovoltaics Piezos Plasma polymerisation Plasmonics Polymers Porous Silicon Protein Crystalography Proteins Quantum Computing Rheology SAW Self-assembly Semiconductors Sensors SERS Soft materials Soft matter Solar Cells Spectroscopy sSNOM Stem cells Supercapacitors Surface chemistry Thin Film Deposition Thin Films Tissue Engineering Wearable Sensors Wearables XFM Submit Reset
